ACS-150NS Non-silicone thermal gap filler pad

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ACS-150NS Non-silicone thermal gap filler pad

Classification scheme： Thermal pad

Product Name：ACS-150NS Non-silicone thermal gap filler pad

TEL：+86-755-83463590

Details

Material: Acrylic, Ceramic powder etc.
Thermal conductivity: 1.5w/mk
Hardness (Shore 00): 50
Thickness: 0.5mm-5.0mm
Application: Photonics, Fiber module, ECU, Hard disk, RAM, ROM etc.

Not only the products
But also thermal solution !

Categories

Thermal interface material

Silicone rubber

EMI solution

Thermoelectric Cooler

Heat sink module and thermal solution

Acoustic Materials

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ACS-150NS Non-silicone thermal gap filler pad

Not only the productsBut also thermal solution !

ACS-150NS Non-silicone thermal gap filler pad

Not only the products
But also thermal solution !